Automated control of the thin films electrical conductivity by the eddy current method

Automated control of the thin films electrical conductivity by the eddy current method

Authors

DOI:

https://doi.org/10.31489/2024no1/74-83

Keywords:

eddy current transducer, electrical conductivity, thin films, copper, non-destructive testing

Abstract

The article considers the possibility of using the eddy current method of non-destructive testing for the problems of measuring the electrical conductivity of thin metal films. As the object of measurement, we used copper films of various thicknesses obtained by vacuum vapor deposition. A review of current trends in the use of copper films in modern industry and science is presented, and an analysis is made of current methods of non-destructive testing suitable for studying thin copper films. A brief description of the deposition method and the hardware-software complex for measuring the electrical conductivity of the film is presented. A calibration curve is presented, which makes it possible to restore the values of the electrical conductivity of the film from the value of the signal of the eddy current transducer. GaAs samples were selected to construct a calibration curve. The decision is explained by the proximity of the values of the electrical conductivity of this chemical compound to the calculated indicators of the obtained thin films. The results of testing films with different characteristics are presented and the distribution of the electrical conductivity of the films depending on the batch is shown. A series of practical measurements of thin films demonstrated the existence of a relationship between the mass of the initial substance that was subjected to deposition and the characteristics of the resulting films. According to different values of electrical conductivity within the same batch, it was concluded that there is a difference in the quality of deposition of different films.

References

Sophian A., Tian G.Y. Electromagnetic and eddy current NDT: A review. Insight, 2001, Vol. 43, pp. 302–306. https://www.researchgate.net/publication/282684852_Electromagnetic_and_eddy_current_NDT_A_review

Auld B.A., Moulder J.C. Review of Advances in Quantitative Eddy Current Nondestructive Evaluation. J. Nondestruct. Eval., 1999, Vol. 18, pp. 3–36. https://doi.org/10.1023/A:1021898520626

Garcia-Martin J., Gomez-Gil J., Vazquez-Sanchez E. Non-Destructive Techniques Based on Eddy Current Testing. Sens., 2011, Vol. 11, pp. 2525–2565. https://doi.org/10.3390/s110302525

Lee H., Jane E., Kevin M. Low Frequency Eddy Current Testing of Insulators and Composites. J. of Nondestr. Eval., 2018, Vol. 37, pp. 58-70. https://doi.org/10.1007/s10921-018-0513-1

Mizukami K., Mizutani Y., Kimura K., Sato A. Visualization and size estimation of fiber waviness in multidirectional CFRP laminates using eddy current imaging. Compos. Part A., 2016, Vol. 90, pp. 261–70. https://doi.org/10.1016/j.compositesa.2016.07.008

Gao B., Lu P., Woo W. L., Tian G. Y., Zhu Y., Johnston M. Variational Bayesian subgroup adaptive sparse component extraction for diagnostic imaging system. IEEE Trans. Ind. Electron, 2018, Vol. 65, No 10, pp. 8142–8152. https://doi.org/10.1109/TIE.2018.2801809

Abidin I. Z., Tian G. Y., Wilson J., Yang S., Almond D. Quantitative evaluation of angular defects by pulsed eddy current thermography. NDT E Int., 2010, Vol. 43, No 7., pp. 537–546. http://dx.doi.org/10.1016/j.ndteint.2010.05.010

Cheng L., Tian G. Y. Surface crack detection for carbon fiber reinforced plastic (CFRP) materials using pulsed eddy current thermography. IEEE Sensors J., 2011, Vol. 11, No 12, pp. 3261-3268. https://doi.org/10.1109/JSEN.2011.2157492

Zijun W., Junzhen Z., Gui Yun T., Francesco C. Comparative analysis of eddy current pulsed thermography and long pulse thermography for damage detection in metals and composites. NDT E Int., 2019, Vol. 107, pp. 102–155. https://doi.org/10.1016/j.ndteint.2019.102155

Zhu Q., Zhang X., Li S., Liu C. Communication-electrodeposition of nano-twinned Cu in void-free filling for blind microvia of high density interconnect. Journal of The Electrochemical Society, 2019, Vol. 166, No 1, pp. 3097-3099. https://doi.org/10.1149/2.0131901jes

Liang C.L., Lin K.L. Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration. Journal of Alloys and Compounds, 2019, Vol. 789, No 15, pp.336-344. https://doi.org/10.1016/j.jallcom.2019.03.055

Baklanov M.R., Adelmann C., Zhao L., Gendt S.D. Advanced interconnects: materials, processing, and reliability. ECS Journal of Solid State Science and Technology, 2015, Vol. 4, No 1, Y1-Y4. https://doi.org/10.1149/2.0271501jss

Shang J., Hao J.X., Hang T., Li M. Diffusion barrier effect of Ta/Ti bilayer in organic dielectric/Cu interconnects. Thin Solid Films, 2018, Vol. 653, No 1, pp.113-118. https://doi.org/10.1016/j.tsf.2018.03.025

Mardani S., Norström H., Smith U. Electromigration behavior of Cu metallization interfacing with Ta versus TaN at high temperatures. Journal of Vacuum Science & Technology, 2016, Vol. B, 34. http://dx.doi.org/10.1116/1.4967372

Laurila T., Zeng K., Kivilahti J.K. Failure mechanism of Ta diffusion barrier between Cu and Si. Journal of Applied Physics, 2000, Vol. 88, pp. 3377-3384. https://doi.org/10.1063/1.1288692

Ono H., Nakano T., Ohta T. Diffusion barrier effects of transition metals for Cu/M/Si multilayers (M=Cr, Ti, Nb, Mo, Ta, W). Applied Physics Letters, 1994, Vol. 64, No. 12, pp.1511-1513. https://doi.org/10.1063/1.111875

Fang J.S., Chen J.H., Chen G.S., Cheng Y.L., Chin T.S. Sequential growth of copper film on TaN/Ta barrier substrates by alternation of Pb-UPD and Cu-SLRR. Electrochimica Acta, 2016, Vol. 206, No.10, pp. 45-51. https://doi.org/10.1016/j.electacta.2016.04.129

Lane M., Dauskardt R.H. Adhesion and reliability of copper interconnects with Ta and TaN barrier layers. Journal of Materials Research, 2000, Vol. 15, No 1. pp. 203-211. https://doi.org/10.1557/JMR.2000.0033

Zantye P.B., Kumar A., Sikder A.K. Chemical mechanical planarization for microelectronics applications. Materials Science and Engineering: R: Reports, 2004, Vol. 45, No 3-6, pp. 89-220. https://doi.org/10.1016/j.mser.2004.06.002

Wrschka P., Hernandez J., Oehrlein G.S. Chemical mechanical planarization of copper damascene structures. Journal of The Electrochemical Society, 2000, Vol. 147, No. 2, pp. 706-712. https://doi.org/10.1149/1.1393256

Xu Q., Fang J., Chen L. A chip-scale chemical mechanical planarization model for copper interconnect structures. Microelectronic Engineering, 2016, Vol. 149, No 5, pp.14-24. https://doi.org/10.1016/j.mee.2015.08.012

Bowler N., Huang Y.Q. Electrical conductivity measurement of metal plates using broadband eddy-current and four-point methods. Measurement Science and Technology, 2006, Vol. 16, No 11, pp. 2193-2200. https://doi.org/10.1088/0957-0233/16/11/009

Fujita T., Kitade K. Development of endpoint detection using optical transmittance and magnetic permeability based on skin effect in chemical mechanical planarization. Precision Engineering, 2019, Vol. 57, pp. 95-103. https://doi.org/10.1016/j.precisioneng.2019.03.004

Wang Z., Yu Y. Thickness and Conductivity Measurement of Multilayered Electricity-Conducting Coating by Pulsed Eddy Current Technique: Experimental Investigation. IEEE Transactions on Instrumentation and Measurement, 2019, Vol. 68, No 9, pp.3166-3172. https://doi.org/10.1109/TIM.2018.2872386

Kjeldby S.B., Evenstad O.M., Cooil S.P., Wells J.W. Probing dimensionality using a simplified 4-probe method. Journal of Physics: Condensed Matter, 2017, Vol. 29, No 39, pp.1-6. https://doi.org/10.1088/1361-648X/aa8296

Kim M.G., Pahk H.J. Fast and reliable measurement of thin film thickness profile based on wavelet transform in spectrally resolved whitelight interferometry. International Journal of Precision Engineering and Manufacturing, 2018, Vol. 19, No 2, pp. 213-219. https://doi.org/10.1007/s12541-018-0024-0

Dmitriev S.F., Malikov V.N., Ishkov A.V. Application of an eddy-current method to measure electrical conductivity of thin films. IOP Conf. Series: Materials Science and Engineering, 2018, Vol. 441, 012029. https://doi.org/10.1088/1757-899X/441/1/012029

Li W., Wang H., Feng Z. Non-contact online thickness measurement system for metal films based on eddy current sensing with distance tracking technique. Review of Scientific Instruments, 2016, Vol. 87, No 4, pp. 1-9. https://doi.org/10.1063/1.4947234

Wang H., Li W., Feng Z. Noncontact thickness measurement of metal films using eddy-current sensors immune to distance variation. IEEE Transactions on Instrumentation and Measurement, 2015, Vol. 64, No 9, pp. 2557-2564. https://doi.org/10.1109/TIM.2015.2406053

Li W., Ye Y., Zhang K. A thickness measurement system for metal films based on eddy current method with phase detection. IEEE Transactions on Industrial Electronics, 2017, Vol. 64, No. 5, pp. 3940-3949. https://doi.org/10.1109/TIE.2017.2650861

Sakran F., Golosovsky M., Goldberger H. High frequency eddy-current technique for thickness measurement of micronthick conducting layers. Applied Physics Letters, 2001, Vol. 78, No 11, pp. 1634-1636. https://doi.org/10.1063/1.1355298

Yin W.L., Xu K. A novel triple-coil electromagnetic sensor for thickness measurement immune to lift-off variations. IEEE Transactions on Instrumentation and Measurement, 2016, Vol. 65, No 1, pp. 164-169. https://doi.org/10.1109/TIM.2015.2479106

Porada O.K., Ivashchenko V.I. Plasma-Enhanced CVD Equipment for Deposition of Nanocomposite Nanolayered Films. Journal of Superhard Materials, 2019, Vol. 41, pp. 32-37. https://doi.org/10.3103/S106345761901004

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Published online

2024-03-29

How to Cite

Malikov В., Ishkov А., Voinash С., Zagidullin Р., & Sabitov Л. (2024). Automated control of the thin films electrical conductivity by the eddy current method. Eurasian Physical Technical Journal, 21(1(47), 74–83. https://doi.org/10.31489/2024no1/74-83

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Engineering

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